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VIA Brings Dual Processing to Mini-ITX with the New VIA EPIA DP-310 Mainboard

Power-saving dual processing on the Mini-ITX form factor creates breakthrough opportunity for developers of high density server systems, appliance servers and compact embedded digital devices.

CeBIT, Hannover, Germany, 11 March 2005 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today launched the VIA EPIA DP-310 Mainboard, the world's first Mini-ITX form factor to introduce dual processing and Gigabit Ethernet networking capability.

The VIA EPIA DP-310 Mini-ITX mainboard is powered by two power-efficient 1GHz VIA Eden-N(TM) processors featuring advanced in-built hardware security, while the acclaimed VIA CN400 digital media chipset, Gigabit Ethernet and an extensive array of high bandwidth I/O, high-speed storage and connectivity options afford an unprecedented level of integration for server and embedded applications.

The additional computing horsepower and advanced communications of the VIA EPIA DP-310 in a small, low power package fulfills the specific requirements of high density server systems, compact appliance servers, communications intensive applications and many other high performance embedded systems, while enabling new server applications such as small-scale rack clusters, multi-user configurations and workgroup computing.

"In bringing power-saving dual processing to the Mini-ITX, VIA has raised the bar yet again for small form factor innovation on the x86 platform, opening the door to an exciting new world of smart networked devices," commented Richard Brown, Associate Vice President of Marketing, VIA Technologies, Inc. "The VIA EPIA DP-310 mainboard provides the perfect balance of performance, compactness and power dissipation to inspire a new generation of embedded and server applications."

The VIA EPIA DP-310 mainboard meets the demand for cost-effective, power-saving dual processing for a new generation of ubiquitous server system designs. Developers can fit two VIA EPIA DP-310 mainboards into a single 1U chassis, or one mainboard per U chassis with two chassis back to back on each rack level, increasing computing density to up to 168 processors in a fully-configured 42U rack while using only 2.5kW of power.

"The VIA EPIA DP Mini-ITX lends itself to an array of vertical markets with rich applications and configurations for implementation in a compact small form factor or high node farm configuration," said Eric Chang, Special Assistant to the President, VIA Technologies, Inc. "It enables even smaller server form factors, while maintaining the ultra low power consumption essential for high density computing environments."

Retaining all the advantages of a low power consumption platform, the VIA EPIA DP-310 dual processor system offers a unique performance advantage for computing intensive environments due to the enhanced multitasking efficiency, while the VIA PadLock Hardware Security Suite enables on-the-fly encrypting/decrypting of sensitive data.

About the VIA EPIA DP-310 Mini-ITX Mainboard The VIA EPIA DP-310 is the latest in the growing line of highly acclaimed VIA EPIA Series of Mini-ITX mainboards and brings dual processing power and Gigabit Ethernet connectivity to the Mini-ITX form factor for the first time, enabling the development of a wealth of high density, low power consumption, fanless, and embedded applications to be implemented in small form factor or node farm configurations with extensive processing resources.

The VIA EPIA DP-310 mainboard boasts dual 1GHz VIA Eden-N processors in the tiny 15cmx15cm nanoBGA packaging for superior processing power, on-die security features through the VIA PadLock Hardware Security Suite and advanced power management through thermal design efficiency and VIA PowerSaver 3.0 technology, making it ideal for highly integrated industrial systems for embedded applications with local processing power, NAS based storage applications, and high performance cluster computing applications.

The VIA CN400 digital media chipset features the UniChrome Pro integrated graphics processor with its 2D/3D graphics engine, hardware digital video acceleration and Chromotion CE video display engine, including hardware MPEG-2/-4 acceleration and advanced video rendering and display technologies, providing strong all-round performance for advanced digital media devices.

Integrating a complete set of advanced computing, multimedia, connectivity and storage capabilities, including 10/100/1000Mbps Gigabit Ethernet and dual 10/100Mbps LAN for seamless network and broadband connectivity, two Serial ATA connectors, ATA-133, up to four USB 2.0, and VIA Vinyl 6-channel Audio support, the VIA EPIA DP is set to expand the reach of x86 architecture to a new wave of personal electronics and commercial devices.

For more information about the VIA EPIA DP-310, please visit the VIA Embedded website at: www.via.com.tw

About VIA Technologies, Inc.

VIA Technologies, Inc. (TSE 2388) is the foremost fabless supplier of market-leading core logic chipsets, low power x86 processors, advanced connectivity, multimedia, networking and storage silicon, and complete platform solutions that are driving system innovation in the PC and embedded markets. Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs, motherboard vendors and system integrators.