News
IBM to build wireless chips under licence from TTPCom
by Guy Kewney | posted on 18 March 2002
IBM has announced that it will be building radio chipsets for 3G and GSM networks, based on the TTPCom RFIC dual system - based on the architectural design, and the IC specfications.
IBM expects to rapidly develop low power RFICs, based on its "industry leading silicon germanium (SiGe) technology," for use in next generation wireless devices, using the TTPCom designs.
"The combination of TTPCom's IP and IBM's leadership in silicon germanium (SiGe) technology will enable us to broaden our circuit portfolio and meet 3G demands", said Ken Torino, Director, Wireless Products, IBM Microelectronics.
TTPCom's dual system 3G/GSM RFIC architecture enables the design of terminals, such as handsets, capable of operating with 2G, 2.5G and 3G networks, allowing subscribers seamless access to these different network standards as the world's cellular operators migrate to 3G services.
"This is our second licence agreement for 3G radio chipsets," said Gordon Aspin, operations director at TTPCom.
sponsored by...
in News
Wireless security - yet another proprietary solution to WEP vulnerability
Nokia mobile "has enough power for VPN security"
UK Bluetooth and GSM market leader sets up in Boston
you're reading:
IBM to build wireless chips under licence from TTPCom
HP is first notebook maker to bundle WiFi wireless "sniffer"